What Is Epochal-70?
Epochal-70 is a blocked modified amine microcapsule epoxy curing agent. The active amine component is enclosed in a microcapsule structure, which helps suppress reactivity at room temperature and provides latency in one-component systems. When the temperature is raised to a certain range, the blocking layer releases the curing agent, allowing it to react with the epoxy resin. According to the technical data sheet, the product also offers some toughening characteristics.
This combination of latency, low-temperature deblocking, and moderate toughening makes Epochal-70 suitable for evaluation in applications where storage stability and curing at relatively low temperatures are important.
Typical Technical Parameters
The following values are taken from the product technical data sheet. They should be used as a starting point for formulation work, not as a substitute for application-specific testing.
Content: 99.5%
Appearance: White powder
Particle size: 10 μm
Melting point: 120°C
Recommended dosage: 10–25%
Curing conditions: 70–120°C for 30–5 minutes
Storage and transport: Non-hazardous; containers should be tightly sealed after use
Shelf life: 24 months
Actual performance will depend on the epoxy resin type, fillers, accelerators, coating thickness, and curing equipment. Formulators should verify these parameters in their own systems.
Key Performance Features
1. Latency and Room-Temperature Storage Stability
Epochal-70 uses a microcapsule blocking technology. At room temperature, the activity of the curing agent is largely suppressed, which can improve the shelf life and working time of one-component epoxy systems. This helps reduce the risk of premature reaction between the curing agent and the epoxy resin during storage or transport.
2. Low-Temperature Deblocking and Curing
The product can deblock and cure within a temperature range of 70–120°C. At the lower end, around 70°C, a curing time of approximately 30 minutes is indicated. At higher temperatures, the curing time can be shortened to about 5 minutes at 120°C. This provides a flexible curing window for heat-sensitive substrates, low-temperature film formation, or continuous production lines.
3. Some Toughening Characteristics
As a modified amine curing agent, Epochal-70 may provide a degree of toughening in the cured system. For adhesives, composites, and other applications where a balance between curing performance and flexibility is needed, this can be a useful property to evaluate.
4. Appearance and Dispersion
Epochal-70 is a white powder with a typical particle size of about 10 μm. It is described as easy to disperse. Films cured at low temperature are reported to be glossy and light in color, which can be advantageous in coatings, inks, and adhesives where appearance and color are important.
5. Formulation Flexibility
Epochal-70 is recommended for use alone as a low-temperature epoxy curing agent. It can also be used in combination with thiol or dicyandiamide-type curing accelerators. This allows formulators to adjust cure speed, pot life, and final properties according to the needs of the application.
Application Areas
Epochal-70 is suitable for a range of epoxy applications, including:
Electronic packaging
Composite molding
Coatings
Inks
Adhesives
In electronic packaging, low-temperature curing can help reduce thermal stress on sensitive components. In composites and adhesives, the latent behavior and toughening characteristics can help balance storage stability and mechanical performance. In coatings and inks, the light color and glossy film formation may support appearance requirements.