In the field of photocurable materials, photoinitiators, as core functional components, directly affect the curing efficiency, stability and final performance of materials. In recent years, with the improvement of material performance requirements in high-end fields such as electronic packaging, 3D printing, and precision optical coatings, the migration and residual odor problems of traditional photoinitiators have gradually become bottlenecks for technology upgrades. The launch of Uyracure-180 (4-(phenylthio)phenyl diphenylsulfonium hexafluoroantimonate) provides an innovative solution for the industry with its unique non-migration characteristics and high-efficiency photosensitivity.
1. Uyracure-180: A non-migration photoinitiator based on triarylsulfonium salts
Uyracure-180 is a triarylsulfonium hexafluoroantimonate compound, whose molecular structure consists of arylsulfonium cations and hexafluoroantimonate anions. This design gives the material multiple advantages:
1. Cationic photoinitiator mechanism: Under ultraviolet (UV) irradiation, sulfonium salts decompose to produce strong acidic substances, which catalyze the ring-opening polymerization of cationic monomers such as epoxy resins to achieve rapid curing;
2. Stability of hexafluoroantimonate anions: Hexafluoroantimonate has high thermal stability and chemical inertness, which can effectively reduce the occurrence of side reactions and improve the purity of the system;
3. Non-migration characteristics: Unlike traditional small molecule photoinitiators, Uyracure-180 fully participates in the reaction after curing, and no low molecular weight residues are precipitated, avoiding problems such as yellowing and pollution caused by migration.
This structural feature makes it a representative product in the field of non-migration photoinitiators, and is particularly suitable for scenarios with strict requirements on material cleanliness and durability.
2. Technical advantages: performance breakthroughs from laboratory to industrialization
1. High photosensitivity and deep curing ability
The absorption spectrum of Uyracure-180 covers the range of 250-350 nm, and is highly compatible with medium-pressure mercury lamps and LED ultraviolet light sources, and can trigger efficient polymerization under low-energy irradiation. The superacid (HSbF6) produced by its decomposition can penetrate deep materials and achieve uniform curing with a thickness of more than 500 μm, solving the problem of uneven curing of traditional photoinitiators in thick coatings or complex structures.
2. Zero migration ensures long-term stability of materials
Traditional photoinitiators may produce small molecular migrants due to incomplete reaction or degradation after curing, resulting in precipitation on the surface of the material, degradation of mechanical properties or contact contamination. As a non-migrating photoinitiator, Uyracure-180 enters the polymer network through complete chemical bonding, completely eliminating the risk of migration. Experimental data show that after 1000 hours of accelerated aging, the yellowing index (ΔYI) of its cured product is less than 1.5, and the volatile content is less than 0.1%, which is significantly better than conventional initiator systems.
3. Wide temperature range adaptability
The product maintains stable activity in the range of -40℃ to 150℃. It can achieve rapid curing in low temperature environments and withstand high temperature post-processing processes (such as reflow soldering), meeting the multi-scenario processing needs of electronic packaging materials.
3. Application scenarios: enabling the development of high-end photocurable materials
1. Electronic packaging and semiconductor protective coatings
In the fields of chip packaging and circuit board protection, the non-migration characteristics of Uyracure-180 can avoid circuit short circuits caused by ion contamination. The dielectric constant (Dk) of its cured film is as low as 2.8@1 GHz, and the loss factor (Df) is less than 0.005, which meets the requirements of 5G high-frequency signal transmission.
2. Medical-grade 3D printing photosensitive resin
For medical 3D printing scenarios such as dental guides and surgical instruments, this product has passed the biocompatibility test (ISO 10993) and has no risk of small molecule precipitation, meeting the safety standards for medical device materials.
3. Optical-grade transparent adhesive
When used for bonding camera modules and AR lenses, the light transmittance of the cured adhesive layer is greater than 99% (400-800 nm), the haze is less than 0.2%, and there is no yellowing after long-term use, ensuring the imaging quality of the optical system.
IV. Industry Value: Promote Green Manufacturing and Material Upgrade
As the EU REACH regulations, China's "Guide Catalogue of Demonstration and Guidance for the First Batch Application of Key New Materials" and other policies have tightened the requirements for material safety and environmental protection, Uyracure-180, as a benchmark product for non-migration photoinitiators, brings three upgrade paths to the industry:
· Green process: reduce post-curing cleaning, deodorization and other post-processing processes, reduce energy consumption and VOC emissions;
· High-end products: break through the limitations of migration problems on material performance, and promote the penetration of photocuring technology into precision fields such as medical and microelectronics;
· Life cycle management optimization: by improving material durability, extending the service life of end products, in line with the concept of circular economy.
Conclusion: Material innovation under technological iteration
In the process of light curing technology evolving from "rapid prototyping" to "high-performance manufacturing", Uyracure-180 is redefining the technical standards of high-end photoinitiators with its comprehensive advantages of no migration, high activity and wide adaptability. In the future, with the popularization of new processes such as UV-LED curing and dual-curing systems, this type of non-migrating photoinitiator is expected to release its potential in more emerging fields and provide key support for the sustainable development of materials science.