Photosensitive resin is a special type of resin, and its main components usually include the following:
1)Oligomer：It determines the physical processing properties and mechanical properties of photosensitive resin, such as hardness, shrinkage rate, photocuring speed, etc.
2)monomer：It is used to dilute oligomers, adjust system viscosity, participate in cross-linking reactions, and affect light curing speed and other performance parameters.
3)Photoinitiator：Essential materials, produce active intermediates, small amount, but good effect, is the key factor in determining the reaction speed of photosensitive resin
4)Additives：Such as pigments, defoamers, leveling agents, etc., can improve product performance.
Our company's T-7128 and T-7130 resins have high viscosity and are suitable for use in paints and coatings. They have good adhesion to inorganic materials such as PP and PE. They are suitable for vacuum plating bases. They have good water resistance, and 7130 has better alcohol resistance. Our T-7131 product has low viscosity and is suitable for coating on glass and metal. It has good adhesion, strong water resistance, and is suitable for ink. It is extremely economical.
Due to the rapid development of photocuring 3D lithography technology, the development of photosensitive resins has been even faster, showing great application potential in the fields of microfluidic chips, precision medical devices, consumer cultural and creative products, mechanical metamaterials, and micromechanical structures. The breadth and depth of applications are also constantly expanding.
Microfluidic Chip