1. Electronic materials
In response to the country's major demand for photosensitive materials in the field of integrated circuits and printed circuits, based on the synthesis technology of photoresponsive functional molecular materials and the research on structure-activity relationship, we carry out the design and preparation of upstream key raw materials, establish efficient synthesis technology of photoinitiators and photocurable monomers/resins, and continuously promote the preparation technology development and domestic substitution of printed circuit photoresist inks, printed circuit solder mask inks, integrated circuit substrate solder mask dry films and integrated circuit KrF/ArF photoresists.
2. Advanced coatings
In response to the need of the pollution reduction and carbon reduction strategy in the coating field, the coating substrate interface adhesion mechanism and curing mechanism were studied for plastic, metal and other substrates, and the development of solvent-free photocuring/electron beam curing metal coatings and solvent-free photocuring/electron beam curing thin film modified coatings were completed. The research of functional coatings such as intelligent anti-corrosion metal coatings, photocuring thermal insulation coatings, and photocuring radiation refrigeration coatings was further promoted.
3. Additive Manufacturing
Ink direct writing (DIW) based on in-situ UV curing can process a variety of materials and construct complex 3D structures. However, UV penetration is low, and multi-scale and large-span unsupported 3D printing cannot be achieved. The research group took the lead in establishing a method of combining DIW and near-infrared (NIR)-induced upconversion particle-assisted photopolymerization, which improved the light source penetration and polymerization uniformity during the in-situ curing of the ink. Through ink design, this method can achieve multi-scale and large-span unsupported 3D printing of multi-color objects, black objects, and high-solid ceramics, breaking through the limitations of traditional DIW.
4. Composite materials
Photocurable composite materials have the advantages of fast curing speed, short molding cycle, low curing temperature, and low environmental pollution. They are widely used in the fields of external protection of thermal insulation layer, pipeline crossing and patching, sewage pool corrosion, leakage protection, marine environment metal anti-corrosion protection, non-excavation repair of municipal drainage pipelines, and photocuring rapid repair of wind turbine blades. Based on the theoretical research foundation of photopolymerization shrinkage stress, curing mechanism, structure-activity relationship, etc., the research group has developed the photocuring preparation of high-performance composite materials and thick composite materials, and developed the in-situ efficient preparation technology of composite materials.
5. Adhesive
Radiation-cured adhesives have the advantages of fast curing rate, high production efficiency, no volatile solvents, and energy saving. Based on the theoretical mechanism research of radiation curing, our research group is committed to the research on the application basis and new technology development of adhesives such as high value, environmental protection and functionalization, and has developed solvent-free high-performance adhesives such as UV-curable adhesives, near-infrared light penetrating curing adhesives, and electron beam-cured pressure-sensitive adhesives.
6. Preparation of functional colloids
Traditionally, colloidal particles are constructed by thermal polymerization, while photopolymerization has the advantages of high efficiency, rapidity, and room temperature. The research team successfully constructed a series of colloidal particles of different forms (porous, multi-core, hollow, core-shell, Janus) by combining photopolymerization technology with the emulsion template method. The morphology and properties of the colloidal particles were regulated by changing the structure and preparation conditions of the photosensitive prepolymer, and these colloidal particles were used in the fields of encapsulation, thermal insulation, toughening, functional coatings, etc.