In the fields of electronics, packaging and automobile manufacturing, the surface treatment of difficult substrates such as glass, metal and plastic film has long faced three major pain points: insufficient adhesion, shrinkage deformation and poor weather resistance. The T-7131 low shrinkage UV resin launched by Shenzhen U-Sunny provides a breakthrough solution for inks, adhesives and pressure-sensitive adhesives through molecular structure innovation.
1. Industry pain points and technological breakthroughs
Adhesion challenges
Traditional UV resins are prone to fall off on non-absorbent substrates (such as PET films and metals) due to low surface energy and curing shrinkage. T-7131 uses a trifunctional aliphatic polyurethane acrylate structure, which can pass the 100-grid adhesion test on glass/metal substrates without a coupling agent, and the chemical bonding force improves the bonding strength of the coating.
Shrinkage deformation control
Plastic substrates (such as PC and PET) are extremely sensitive to curing shrinkage and are prone to curling or warping. T-7131 reduces the shrinkage rate to an extremely low level by optimizing the molecular chain segments, and with a 25% elongation at break, balances rigidity and flexibility to avoid deformation and cracking.
Weather resistance and chemical corrosion
Electronic equipment cleaning fluids and outdoor environments place strict requirements on the durability of the coating. T-7131 remains stable in acidic and alkaline environments and high-temperature water bubbles, and its chemical corrosion resistance extends the life of screen protection ink by more than 30%.
2. Analysis of multi-field application scenarios
High-performance UV ink
Printing ink: T-7131's 1600mPa·s viscosity (25℃) ensures uniform ink spreading, and its low shrinkage property avoids deformation of printed patterns, making it suitable for high-precision screen printing on glass panels.
Electronic ink: The transmittance is close to the original color of the substrate (Gardner chromaticity ≤1), meeting the scratch resistance and optical transparency requirements of touch screen protection ink.
Adhesive and pressure-sensitive adhesive innovation
After curing, it forms a high-hardness film layer (Tg=25℃), which is suitable for electronic component packaging and bonding;
Combined with bio-based resins (such as Changxing 6121B), solvent-free UV pressure-sensitive adhesives are developed to meet the low migration requirements of food packaging.
Functional coating expansion
In automotive metal trim coatings, T-7131 compounded with high-functionality resins (such as 7133) can improve weather resistance and resist UV aging.
3. Environmental trends and future directions
As the EU REACH regulations become stricter, UV resins are transitioning to low-VOC, bio-based raw materials. The acid value of T-7131 is ≤15mg KOH/g, which reduces the risk of metal corrosion. In the future, it can be combined with water-based UV technology to solve wettability defects and promote green upgrades in the packaging and printing industry
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Facing the coating challenges of difficult substrates such as glass, metal, and special plastics, Shenzhen U-Sunny T-7131 low shrinkage UV resin has achieved three breakthrough values through molecular design:
Strong adhesion - overcoming the bottleneck of non-absorbent substrate bonding, the Baige test compliance rate has increased to 99.5%
Zero warpage curing - precise control of shrinkage rate <3%, completely solving the pain point of deformation and cracking of plastic substrates
Long-term protection - chemical resistance is increased by more than 30%, providing ten-year protection for electronic inks and automotive adhesives