TS-6080 is a high-performance, difunctional ultraviolet-curable hot-melt resin, specifically designed for demanding bonding applications in the electronics and electrical industries where reliability, toughness, and adhesion are critical. Its unique "solid at room temperature, hot-melt application, rapid UV curing" characteristics perfectly combine processing convenience with exceptional end-use performance, making it ideal for reliably bonding diverse substrates.
Key Features
High Toughness Formulation: Maintains excellent flexibility and impact resistance even at millimeter-level thick bond lines, effectively relieving stress.
Exceptional & Broad Adhesion: Exhibits strong and durable adhesion to a wide range of substrates, including engineering plastics (PI), composites (PCB/FPC), metals, and glass.
Excellent Process Compatibility: Suitable for both lamination/anaerobic curing and UV transfer molding processes. Compatible with mainstream Mercury Lamps and UV LED light sources for fast curing.
Superior Reliability: The cured adhesive layer offers outstanding resistance to high temperature & humidity and thermal shock, ensuring long-term stability of electronic devices in harsh environments.
Outstanding Processing Convenience: Non-tacky solid at room temperature, allowing for easy winding, die-cutting, and pre-lamination, enabling clean, precise, and automated operations.
Technical Specifications
| Property | Specification |
|---|---|
| Appearance | Colorless transparent gel |
| Effective Content | 100% |
| Melting Temperature | 80 - 100 °C |
| Acid Value | ≤ 5 mg KOH/g |
| Relative Density | 0.95 - 1.05 |
| Functionality | 2 |
Primary Applications
Flexible Printed Circuits (FPC): Bonding to PI substrates, stiffener attachment, component fixation.
Printed Circuit Boards (PCB): Localized component protection, shield can bonding, metal part attachment.
Consumer Electronics: Bonding PET films to glass/metal, decorative part assembly, touchscreen lamination.
Automotive Electronics: Sensor potting, control module bonding and sealing, meeting stringent environmental resistance requirements.
Glass Products: Structural bonding of glass to metal or plastic.
Others: Suitable for various industrial bonding scenarios requiring precise pre-forming, high toughness, and high reliability.
Processing Guidelines
Preparation: The material is a solid film or pre-form at room temperature and can be directly die-cut or shaped to match the product geometry.
Application Process:
Heating: Heat the material or assembly to 80-100°C. The resin will melt into a transparent liquid, becoming tacky.
Lamination: While molten, promptly align and laminate the parts to be bonded. Apply slight pressure to ensure good wetting and bubble removal.
Curing Conditions:
Light Source: Recommended use of UV LED (e.g., 365nm or 385nm) or conventional mercury lamp.
Energy Dose: Adjust based on bond line thickness and transparency. Typically requires 500 - 2000 mJ/cm² of UV energy.
Environment: For deep-section curing or specific formulations, curing under a nitrogen atmosphere (anaerobic conditions) is recommended to achieve optimal surface cure.
Advantages Explained
Functionality = 2: Provides an optimal crosslink density, striking the best balance between cure speed, flexibility, and hardness. This is key to its high toughness.
Low Acid Value (≤5): Indicates a chemically mild product with very low corrosivity to sensitive substrates like metals, ensuring superior long-term reliability.
Precise Melting Range (80-100°C): Facilitates process control, ensuring sufficient flow and wetting while avoiding damage to heat-sensitive components from excessive temperatures.
100% Effective Content: Solvent-free, no VOC emission during curing, low shrinkage, and environmentally friendly.
Compatibility & Storage
Compatibility: Miscible with most acrylate monomers and solvents like esters and ketones, allowing for formulation modifications.
Storage: Store in a sealed container in a cool, dry place (recommended temperature <30°C). Protect from direct UV light. Shelf life is typically 12 months under recommended conditions.
Safety Notes: Wear protective equipment during hot-melt operations to avoid burns. Wear protective eyewear during UV curing to avoid eye exposure to ultraviolet light.
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