Vacuum plating: also known as physical vapor deposition (PVD), which is to hit atoms onto the surface of the target material under vacuum to achieve the purpose of coating. It was first used in optical lenses, such as marine telescope lenses. Later, with the improvement of technology, it was extended to decorative coatings and surface modification of materials such as records, disks, CDs, mobile phone shells, and mechanical tools.
Applicable materials
Almost all metals, alloys, and ceramic materials.
1,Natural materials will affect the vacuum environment and are not suitable for vacuum plating.
2,In addition to natural materials, materials suitable for vacuum plating include metal materials, soft and hard plastics (ABS materials, ABS+PC materials, PC materials, etc.), composite materials, ceramics, and glass.
3,The most commonly used surface treatment for vacuum plating is aluminum, followed by silver and copper.
Steps: First spray a layer of primer on the workpiece, and then do electroplating. Since the workpiece is a plastic part, air bubbles and organic gases will remain during injection molding, and moisture in the air will be absorbed when placed. In addition, since the plastic surface is not flat enough, the surface of the workpiece directly electroplated is not smooth, the gloss is low, the metal feel is poor, and there will be bubbles, blisters and other undesirable conditions. After spraying a layer of primer, a smooth and flat surface will be formed, and the generation of bubbles and blisters existing in the plastic itself will be eliminated, so that the effect of electroplating can be displayed.
Vacuum evaporation plating process flow
Workpiece>Pre-plating treatment>Assembly>Baking>Ion bombardment>Pre-melting>Evaporation deposition>Cooling>Removal>Post-processing>Finished product
Vacuum sputtering plating process flow
Workpiece>Pre-plating treatment>Assembly>Evacuation>Baking, bombardment>Pre-melting>Sputtering deposition>Cooling>Removal>Post-processing>Finished product
Vacuum ion plating process flow
Workpiece>Pre-plating treatment>Assembly>Evacuation>Baking>Ion bombardment>Ion deposition>Cooling>Removal>Post-processing>Finished product