Optical Grade · Low Refractive Index · Low Stress · High Temperature & Humidity Resistance
Product Overview
U-6143 is a cationic hybrid UV resin designed with optical-grade properties. It features very low viscosity, moderate curing speed, and broad adhesion adaptability to various substrates.
The resin exhibits low volume shrinkage and minimal internal stress, maintaining stability under damp heat conditions and high-temperature processes such as wave soldering. Its relatively low dielectric constant makes it suitable for microelectronics packaging, 5G signal transmission, and nanoimprint lithography.
Key Features
| Feature | Description |
|---|---|
| Low Refractive Index | Naturally low, can be further reduced with special nano-silica sol |
| High Transparency | Excellent light transmittance after curing, ideal for optical coatings |
| Very Low Viscosity | Easy filling of micro/nano structures, suitable for precision coating & imprinting |
| Moderate Curing Speed | Wide processing window; cure rate can be adjusted via formulation |
| Low Shrinkage & Low Stress | Reduces cracking and substrate deformation, improves adhesion reliability |
| Damp Heat & High-Temperature Resistance | Withstands wave soldering; meets automotive & consumer reliability standards |
| Low Dielectric Constant | Suitable for 5G high-frequency signal transmission, lowers signal loss |
| Salt Spray & Chemical Resistance | Maintains excellent corrosion resistance of cationic systems |
Typical Applications
UV Adhesives
Optical Fiber Coating: Stable over high-low temperature cycles; low refractive index change ensures optical coupling efficiency
Solder Joint Protection: Low internal stress, damp heat resistant, passes salt spray tests
UV Coatings
Anti-Reflective / Anti-Glare Coatings: Low refractive index design; can be combined with nano-silica sol for enhanced transmittance
Nanoscale Coatings: Fast curing response, suitable for high-precision coating processes
Thick Films: Maintains toughness without cracking, low internal stress
Nanoimprint Lithography & Transfer Processes
Low viscosity allows easy filling of mold microstructures; low shrinkage ensures high pattern fidelity
Cured film provides structural integrity and protective function
Microelectronics & 5G Signal Transmission
Low dielectric constant insulating layer reduces high-frequency loss
Can be used in chip protection layers and antenna module encapsulation
Formulation Compatibility
U-6143 offers broad compatibility:
Nano-silica sol: Compatible with specially surface-treated nano-silica sol to further reduce refractive index while maintaining high transparency
Organic solvents: Fully miscible with common solvents (ketones, esters, aromatics, etc.) for easy viscosity and solids content adjustment
Polymers: Fully miscible with Ultramodern series cationic resins in any ratio to tailor crosslink density and flexibility
Usage Recommendations
Curing source: 365 nm or 385 nm UV-LED, or medium-pressure mercury lamp
Humidity: Recommended <60% RH to avoid surface tackiness caused by proton scavenging
Alkaline substrates: For glass, metal oxides, etc., use a primer or increase photoinitiator loading
Storage: Store at 5–35°C in original, sealed, light-resistant containers. Shelf life: 12 months
Typical Technical Data (Reference Values)
| Parameter | Typical Value |
|---|---|
| Appearance | Clear to slightly hazy liquid |
| Viscosity (25°C) | Very low (refer to COA) |
| Refractive Index | Low |
| Volume Shrinkage | <3% |
| Dielectric Constant (1 MHz) | Low |
| Recommended Cure Energy | 1000–3000 mJ/cm² |
Note: Please refer to the Certificate of Analysis (COA) for exact specifications.
Contact Us
For TDS, SDS, sample requests, or formulation support, please contact our sales team.
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